logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9922946 B1

PDFFull Text
Date of Patent:
Mar. 20, 2018

Filed:

Apr. 06, 2017

Method of manufacturing a semiconductor package having a semiconductor chip and a microwave component

Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Ernst Seler, Munich, DE;

Maciej Wojnowski, Munich, DE;

Walter Hartner, Bad Abbach, DE;

Josef Boeck, Putzbrunn, DE;

Assignee:

INFINEON TECHNOLOGIES AG, Neubiberg, DE;

Attorney:

Murphy, Bilak & Homiller, PLLC

Primary Examiner:

Peniel M Gumedzoe

Int. Cl.
CPC ...
H01L 23/66 (2006.01); H01L 23/538 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 21/48 (2006.01); H01Q 13/08 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 21/486 (2013.01); H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/565 (2013.01); H01L 23/3114 (2013.01); H01L 23/5383 (2013.01); H01L 23/5384 (2013.01); H01L 23/5386 (2013.01); H01L 23/5389 (2013.01); H01Q 13/08 (2013.01); H01L 2223/6616 (2013.01); H01L 2223/6627 (2013.01); H01L 2223/6677 (2013.01);
Abstract

A method of manufacturing a semiconductor device package includes placing a semiconductor chip on a carrier, covering the semiconductor chip with an encapsulation material to form an encapsulation body, providing a microwave component having at least one electrically conducting wall structure integrated in the encapsulation body, and forming an electrical interconnect configured to electrically couple the semiconductor chip and the microwave component.

Find Patent Forward Citations

Seler, Ernst. (2018). Method of manufacturing a semiconductor package having a semiconductor chip and a microwave component (U.S. Patent No. 9922946). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9922946

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…