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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9922938 B1

PDFFull Text
Date of Patent:
Mar. 20, 2018

Filed:

Sep. 06, 2016

Semiconductor device package integrated with coil for wireless charging and electromagnetic interference shielding, and method of manufacturing the same

Applicant:

Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;

Inventors:

Ming-Horng Tsai, Kaohsiung, TW;

Wei-Yu Chen, Kaohsiung, TW;

Chun-Chia Lee, Kaohsiung, TW;

Huan Wun Li, Kaohsiung, TW;

Assignee:

ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaosiung, TW;

Attorneys:

Foley & Lardner LLP

Cliff Z. Liu

Primary Examiner:

Mohsen Ahmadi

Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/552 (2006.01); H01L 23/498 (2006.01); H01L 23/31 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/538 (2006.01); H01L 23/64 (2006.01); H02J 50/10 (2016.01); H01L 25/065 (2006.01); H02J 7/02 (2016.01); H01L 23/04 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 21/485 (2013.01); H01L 21/486 (2013.01); H01L 21/4817 (2013.01); H01L 21/4853 (2013.01); H01L 21/565 (2013.01); H01L 23/3114 (2013.01); H01L 23/49811 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/5386 (2013.01); H01L 23/645 (2013.01); H01L 24/16 (2013.01); H01L 25/0655 (2013.01); H02J 7/025 (2013.01); H02J 50/10 (2016.02); H01L 23/04 (2013.01); H01L 24/13 (2013.01); H01L 24/48 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/15313 (2013.01); H01L 2924/181 (2013.01); H01L 2924/1815 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/3025 (2013.01);
Abstract

The present disclosure relates to a semiconductor device package which includes a carrier, an electronic component disposed on the carrier, and a package body disposed on the carrier and encapsulating the electronic component. A shield is disposed on the package body. The shield includes multiple non-magnetic conductive layers, multiple insulating layers and multiple magnetic conductive layers. At least one of the insulating layers is located between each non-magnetic conductive layer and a neighboring magnetic conductive layer.

Find Patent Forward Citations

Tsai, Ming-Horng. (2018). Semiconductor device package integrated with coil for wireless charging and electromagnetic interference shielding, and method of manufacturing the same (U.S. Patent No. 9922938). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9922938

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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