The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 20, 2018

Filed:

Aug. 19, 2015
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Yuichiro Inatomi, Nirasaki, JP;

Takashi Tanaka, Nirasaki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D 3/12 (2006.01); H01L 21/288 (2006.01); H01L 21/768 (2006.01); B05D 1/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/288 (2013.01); H01L 21/76843 (2013.01); H01L 21/76871 (2013.01); H01L 21/76898 (2013.01); B05D 1/005 (2013.01); H01L 21/76874 (2013.01); H01L 21/76877 (2013.01);
Abstract

A Plating method includes a first plating process Sof supplying a first plating liquid to a substratehaving a recessand forming a first plating layer; and a second plating process of supplying a second plating liquid to the substrateand forming a second plating layeron the first plating layerafter the first plating process S. Here, a concentration of an additive contained in the first plating liquid is different from that in the second plating liquid. The first plating process Sincludes a process of forming the first plating layer of a discontinuous film or a particle shape on the substrateby rotating the substrateat a first speed and a process of rotating the substrateat a second speed and at a third speed repeatedly.


Find Patent Forward Citations

Loading…