The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 20, 2018
Filed:
Dec. 05, 2012
Applicant:
Atotech Deutschland Gmbh, Berlin, DE;
Inventors:
Thomas Thomas, Berlin, DE;
Lutz Brandt, Englewood, CO (US);
Lutz Stamp, Berlin, DE;
Hans-Jürgen Schreier, Velten, DE;
Assignee:
Atotech Deutschland GmbH, Berlin, DE (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B05D 3/10 (2006.01); C23C 28/00 (2006.01); C25D 5/54 (2006.01); C23C 18/20 (2006.01); C23C 18/18 (2006.01); B82Y 30/00 (2011.01); C23C 18/16 (2006.01); C25D 7/12 (2006.01); H05K 3/38 (2006.01);
U.S. Cl.
CPC ...
C23C 28/345 (2013.01); B82Y 30/00 (2013.01); C23C 18/165 (2013.01); C23C 18/1653 (2013.01); C23C 18/18 (2013.01); C23C 18/1865 (2013.01); C23C 18/1893 (2013.01); C23C 18/2033 (2013.01); C23C 18/2066 (2013.01); C25D 5/54 (2013.01); C25D 7/12 (2013.01); H05K 3/389 (2013.01);
Abstract
A method is provided for metallization of substrates providing a high adhesion of the deposited metal to the substrate material and thereby forming a durable bond. The method applies novel adhesion promoting agents comprising nanometer-sized particles prior to metallization. The particles have at least one attachment group bearing a functional chemical group suitable for binding to the substrate.