The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 20, 2018
Filed:
Jun. 24, 2014
Sumco Corporation, Tokyo, JP;
Tomonori Kawasaki, Tokyo, JP;
SUMCO CORPORATION, Tokyo, JP;
Abstract
A practical method of polishing a wafer that can reduce wafer loss due to dummy polishing, and stabilize the LPD count in production wafers at a low level, is provided. In the method of polishing a wafer according to the present disclosure, a waferis brought into contact with a polishing clothprovided on the surface of a polishing plate, and the waferand the polishing plateare rotated, thereby performing several rounds of a polishing process on the surface of the waferusing the same polishing cloth. At this time, the contact angle of the polishing cloth is measured, and based on the measured value thereof, the timing for a switchover from an initial polishing (or a dummy polishing) mode to a production polishing mode is determined.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile