The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 13, 2018

Filed:

Oct. 16, 2017
Applicant:

Shinko Electric Industries Co., Ltd., Nagano, JP;

Inventor:

Tomoyuki Shimodaira, Nagano, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H01L 23/498 (2006.01); H05K 1/09 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0213 (2013.01); H01L 21/4853 (2013.01); H01L 23/49811 (2013.01); H01L 23/49838 (2013.01); H01L 23/49866 (2013.01); H05K 1/09 (2013.01);
Abstract

A wiring substrate includes a wiring layer, an insulating layer covering the wiring layer, and a protruding electrode including a protruding metal layer and a surface metal layer. The protruding metal layer is connected to the wiring layer in an opening of the insulating layer, extends from within the opening to be stepped at the edge of the opening to extend outward onto the insulating layer, and includes a first surface contacting a surface of the insulating layer around the opening, a second surface, and a peripheral surface extending between the first and second surfaces, and bent inward to form a space between the peripheral surface and the surface of the insulating layer. The surface metal layer covers the protruding metal layer without contacting the surface of the insulating layer, and is formed of a metal having a lower melting point than the protruding metal layer.


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