The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 13, 2018

Filed:

Jun. 13, 2014
Applicants:

Ziqiang Tong, Munich, DE;

Ralf Reuter, Munich, DE;

Inventors:

Ziqiang Tong, Munich, DE;

Ralf Reuter, Munich, DE;

Assignee:

NXP USA, Inc., Austin, TX (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01Q 19/00 (2006.01); H01Q 19/10 (2006.01); G01S 13/02 (2006.01); G01S 7/03 (2006.01); G01S 13/08 (2006.01); H01Q 9/04 (2006.01); H01Q 23/00 (2006.01); G01S 13/93 (2006.01); G01S 7/02 (2006.01); H01P 5/107 (2006.01);
U.S. Cl.
CPC ...
H01Q 19/10 (2013.01); G01S 7/03 (2013.01); G01S 13/02 (2013.01); G01S 13/08 (2013.01); H01Q 9/0407 (2013.01); H01Q 23/00 (2013.01); G01S 13/931 (2013.01); G01S 2007/028 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16235 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1041 (2013.01); H01L 2225/1058 (2013.01); H01P 5/107 (2013.01);
Abstract

An integrated circuit package comprises a dielectric material, a first stack comprising at least a first electrically isolating layer and a second electrically isolating layer arranged at a first side of the integrated circuit package, an electrically conductive material arranged on a second side opposed to the first side, and an integrated antenna structure for transmitting and/or receiving a radio frequency signal arranged between the first and second electrically isolating layers. The electrically conductive material is separated from the integrated antenna structure by at least the dielectric material and the first electrically isolating layer, arranged to partly overlap the integrated antenna structure and to reflect the radio frequency signal received by the electrically conductive material through at least the first electrically isolating layer and the dielectric material to the first side.


Find Patent Forward Citations

Tong, Ziqiang. (2018). Integrated circuit package with radio frequency coupling arrangement (U.S. Patent No. 9917372). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9917372

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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