The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 13, 2018

Filed:

May. 16, 2013
Applicant:

National University of Singapore, Singapore, SG;

Inventors:

Xuepeng Qiu, Singapore, SG;

Hyunsoo Yang, Singapore, SG;

Young Jun Shin, Singapore, SG;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05H 1/24 (2006.01); C23C 16/50 (2006.01); C23C 14/18 (2006.01); C23C 14/22 (2006.01); C23C 14/34 (2006.01); C23C 16/458 (2006.01); C23C 16/48 (2006.01);
U.S. Cl.
CPC ...
C23C 16/50 (2013.01); C23C 14/185 (2013.01); C23C 14/225 (2013.01); C23C 14/34 (2013.01); C23C 16/458 (2013.01); C23C 16/48 (2013.01);
Abstract

Various embodiments relate a method for depositing a layer onto a workpiece using plasma. The method comprises arranging the workpiece and a source material inside a vacuum chamber. The method also comprises applying energy to the source material to cause atoms of the source material to be ejected from a surface of the source material into a plasma. The method further comprises orientating the workpiece with respect to the source material to prevent direct propagation of the ejected atoms from the source material to a work surface of the workpiece and to permit deposition of the layer onto the workpiece by ejected atoms which impact the work surface after colliding with particles of the plasma. Various embodiments also provide a corresponding apparatus.


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