The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 13, 2018

Filed:

Oct. 02, 2015
Applicants:

Tyco Electronics Corporation, Berwyn, PA (US);

Tyco Electronics Amp Korea Co., Ltd., Kyongsangbuk-Do, KR;

Inventors:

Bruce Bishop, Aptos, CA (US);

Jung Hoon Kim, Gyeonggi-Do, KR;

June Gun Park, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 21/00 (2006.01); H01Q 1/38 (2006.01); H01Q 1/50 (2006.01); H05K 3/10 (2006.01); B23K 26/00 (2014.01); B23K 26/351 (2014.01); B23K 26/34 (2014.01); H01Q 1/24 (2006.01);
U.S. Cl.
CPC ...
B23K 26/351 (2015.10); B23K 26/0087 (2013.01); B23K 26/34 (2013.01); H01Q 1/243 (2013.01);
Abstract

A method of manufacturing a 3D LDS liner includes providing an LDS sheet, forming 3D contoured liners in the LDS sheet, laser structuring circuit patterns on the 3D contoured liners to provide a laser structured circuit pattern, selectively plating the laser structured circuit patterns to form circuits on the 3D contoured liners, and removing the 3D contoured liners from the LDS sheet. A formed LDS liner includes a thin LDS film having a 3D contoured surface vacuum formed from an LDS sheet. The LDS film includes an inner surface and an outer surface. A laser structured circuit pattern is etched into the LDS film, and a conductive layer is selectively plated on the laser structured circuit pattern forming a circuit on the LDS film. The circuit may have a non-planar region.


Find Patent Forward Citations

Loading…