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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9913405 B1

PDFFull Text
Expired
Date of Patent:
Mar. 06, 2018

Filed:

Mar. 25, 2015

Glass interposer with embedded thermoelectric devices

Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Jeffrey P. Gambino, Portland, OR (US);

Richard S. Graf, Gray, ME (US);

Sudeep Mandal, Bangalore, IN;

David J. Russell, Owego, NY (US);

Assignee:

GLOBALFOUNDRIES INC., Grand Cayman, KY;

Attorneys:

Scully Scott Murphy and Presser

Steven Fischman

Primary Examiner:

Hsin-Yi Hsieh

Int. Cl.
CPC ...
H01L 21/00 (2006.01); H05K 7/20 (2006.01); H01L 35/34 (2006.01); H01L 23/15 (2006.01); H01L 23/38 (2006.01); H05K 1/03 (2006.01); H01L 23/13 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H05K 7/2039 (2013.01); H01L 23/15 (2013.01); H01L 23/38 (2013.01); H01L 35/34 (2013.01); H01L 23/13 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 2224/13099 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15788 (2013.01); H01L 2924/181 (2013.01); H05K 1/0306 (2013.01); H05K 2201/10219 (2013.01); H05K 2201/10378 (2013.01);
Abstract

The present invention relates generally to integrated circuit (IC) chip packaging, and more particularly, to a structure and method of forming a glass interposer having one or more embedded peltier devices, alongside electrically conductive vias, to help dissipate heat from one or more IC chips in a multi-dimensional chip package through the glass interposer and into an organic carrier, where it can be dissipated into an underlying substrate.

Find Patent Forward Citations

Gambino, Jeffrey. (2018). Glass interposer with embedded thermoelectric devices (U.S. Patent No. 9913405). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9913405

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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