The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 06, 2018
Filed:
Aug. 23, 2016
Shinko Electric Industries Co., Ltd., Nagano, JP;
Toyoaki Sakai, Nagano, JP;
SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano, JP;
Abstract
A wiring board includes an insulating layer, a first wiring layer, and a second wiring layer. The first wiring layer is formed in a first surface of the insulating layer, and includes a pad on which a semiconductor chip is to be mounted and a wiring pattern. The second wiring layer is formed on a second surface of the insulating layer opposite to the first surface. The roughness of a surface of the first wiring layer exposed at the first surface of the insulating layer is smaller than the roughness of a surface of the second wiring layer exposed on the second surface of the insulating layer.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile