The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 06, 2018

Filed:

Nov. 23, 2016
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Wookyung You, Suwon-si, KR;

Jongmin Baek, Suwon-si, KR;

Sanghoon Ahn, Goyang-si, KR;

Sangho Rha, Seongnam-si, KR;

Naein Lee, Seoul, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 21/02 (2006.01); H01L 21/311 (2006.01); H01L 23/522 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 21/7682 (2013.01); H01L 21/02126 (2013.01); H01L 21/02203 (2013.01); H01L 21/02208 (2013.01); H01L 21/02271 (2013.01); H01L 21/02274 (2013.01); H01L 21/02345 (2013.01); H01L 21/02348 (2013.01); H01L 21/311 (2013.01); H01L 21/31144 (2013.01); H01L 21/76834 (2013.01); H01L 21/76877 (2013.01); H01L 23/5222 (2013.01); H01L 23/53295 (2013.01); H01L 2221/1047 (2013.01); H01L 2924/0002 (2013.01);
Abstract

The present disclosure describes semiconductor devices and methods of fabricating the same. The method includes forming an interlayer insulating layer on a substrate and forming conductive patterns in the interlayer insulating layer. A pore density of an upper portion of the interlayer insulating layer is higher than that of a lower portion of the interlayer insulating layer, and a pore density of an intermediate portion of the interlayer insulating layer gradually increases toward the upper portion of the interlayer insulating layer. An air gap is provided between the conductive patterns.


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