The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 06, 2018

Filed:

Mar. 13, 2014
Applicant:

Tel Fsi, Inc., Chaska, MN (US);

Inventors:

Kevin L Siefering, Excelsior, MN (US);

William P Inhofer, Plymouth, MN (US);

Assignee:

TEL FSI, INC., Chaska, MN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/302 (2006.01); H01L 21/461 (2006.01); C03C 15/00 (2006.01); C03C 25/68 (2006.01); H01L 21/67 (2006.01); H01L 21/3213 (2006.01); H01L 21/48 (2006.01); H01L 21/02 (2006.01); H01L 21/306 (2006.01); G05B 19/418 (2006.01); H01L 21/311 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67075 (2013.01); G05B 19/418 (2013.01); H01L 21/02019 (2013.01); H01L 21/30608 (2013.01); H01L 21/31111 (2013.01); H01L 21/32134 (2013.01); H01L 21/4835 (2013.01); H01L 21/6708 (2013.01); H01L 21/67017 (2013.01);
Abstract

Embodiments of the invention provide a processing system and a method for processing with a heated etching solution. In one example, tight control over temperature and hydration level of an acidic etching solution is provided. According to one embodiment, the method includes forming the heated etching solution in a first circulation loop, providing the heated etching solution in the process chamber for treating a substrate, forming an additional heated etching solution in a second circulation loop, and supplying the additional heated etching solution to the first circulation loop. According to one embodiment, the processing system includes a process chamber for treating the substrate with the heated etching solution, a first circulation loop for providing the heated etching solution into the process chamber, and a second circulation loop for forming an additional heated etching solution and supplying the additional heated etching solution to the first circulation loop.


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