The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 06, 2018

Filed:

Dec. 19, 2013
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Josef Boeck, Putzbrunn, DE;

Rudolf Lachner, Ingolstadt, DE;

Maciej Wojnowski, München, DE;

Walter Hartner, Bad Abach, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01S 13/93 (2006.01); G01S 13/86 (2006.01); G01S 7/02 (2006.01); H04B 1/40 (2015.01); G01S 13/00 (2006.01); G01S 7/00 (2006.01); G01S 7/03 (2006.01); G01S 13/87 (2006.01);
U.S. Cl.
CPC ...
G01S 13/86 (2013.01); G01S 7/006 (2013.01); G01S 7/02 (2013.01); G01S 13/003 (2013.01); H04B 1/40 (2013.01); G01S 7/032 (2013.01); G01S 13/878 (2013.01); G01S 13/931 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01);
Abstract

A wireless communication system includes a first semiconductor module and a second semiconductor module. The first semiconductor module includes a semiconductor die connected to an antenna structure. The semiconductor die of the first semiconductor module and the antenna structure of the first semiconductor module are arranged within a common package. The semiconductor die of the first semiconductor module includes a transmitter module configured to transmit the wireless communication signal through the antenna structure of the first semiconductor module. The second semiconductor module includes a semiconductor die connected to an antenna structure. The semiconductor die of the second semiconductor module includes a receiver module configured to receive the wireless communication signal through the antenna structure of the second semiconductor module from the first semiconductor module.


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