The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 06, 2018

Filed:

Dec. 04, 2015
Applicant:

Atotech Deutschland Gmbh, Berlin, DE;

Inventors:

Heiko Brunner, Berlin, DE;

Lars Kohlmann, Berlin, DE;

Sengül Karasahin, Berlin, DE;

Matthias Dammasch, Berlin, DE;

Simon Pape, Berlin, DE;

Sandra Lucks, Berlin, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 18/50 (2006.01); C23C 18/36 (2006.01); C23C 18/40 (2006.01);
U.S. Cl.
CPC ...
C23C 18/50 (2013.01); C23C 18/36 (2013.01); C23C 18/40 (2013.01); C23C 18/405 (2013.01);
Abstract

The present invention relates to additives which may be employed in electroless metal and metal alloy plating baths and a process for use of said plating baths. Such additives reduce the plating rate and increase the stability of electroless plating baths and therefore, such electroless plating baths are particularly suitable for the deposition of said metal or metal alloys into recessed structures such as trenches and vias in printed circuit boards, IC substrates and semiconductor substrates. The electroless plating baths are further useful for metallization of display applications.


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