The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 06, 2018

Filed:

Jan. 11, 2016
Applicants:

Rohm and Haas Electronic Materials Llc, Marlborough, MA (US);

Dow Global Technologies Llc, Midland, MI (US);

Inventors:

Zhifeng Bai, Midland, MI (US);

Mark S. Oliver, Charlestown, MA (US);

Michael K. Gallagher, Hopkinton, MA (US);

Christopher J. Tucker, Midland, MA (US);

Karen R. Brantl, West Springfield, MA (US);

Elissei Iagodkine, Marlborough, MA (US);

Zidong Wang, Southborough, MA (US);

Assignees:

Rohm and Haas Electronic Materials LLC, Marlborough, MA (US);

Dow Global Technologies LLC, Midland, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 71/02 (2006.01); C09J 11/08 (2006.01); C09J 143/04 (2006.01); C09J 5/06 (2006.01); H01L 21/683 (2006.01); B32B 7/06 (2006.01); B32B 7/12 (2006.01); C08K 5/06 (2006.01); C09J 171/02 (2006.01); C09J 125/18 (2006.01);
U.S. Cl.
CPC ...
C09J 143/04 (2013.01); B32B 7/06 (2013.01); B32B 7/12 (2013.01); C08K 5/06 (2013.01); C09J 5/06 (2013.01); C09J 171/02 (2013.01); H01L 21/6835 (2013.01); C08L 71/02 (2013.01); C09J 11/08 (2013.01); C09J 125/18 (2013.01); C09J 2471/00 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68381 (2013.01); Y10T 156/10 (2015.01); Y10T 428/2848 (2015.01);
Abstract

Compositions containing an adhesive material, a release additive and a compatibilizer are suitable for temporarily bonding two surfaces, such as a wafer active side and a substrate. These compositions are useful in the manufacture of electronic devices where a temporary bonding of a component to a substrate is desired.


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