The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 27, 2018

Filed:

Nov. 14, 2013
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventors:

Takashi Numagi, Kawasaki, JP;

Hikaru Nomura, Tokyo, JP;

Masanori Kikuchi, Yokohama, JP;

Hiroyuki Mizuno, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/10 (2006.01); H05K 7/12 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0216 (2013.01); H05K 1/0251 (2013.01); H05K 1/0298 (2013.01); H05K 1/111 (2013.01); H05K 1/115 (2013.01); H05K 1/181 (2013.01); H05K 1/0243 (2013.01); H05K 1/114 (2013.01); H05K 3/429 (2013.01); H05K 2201/097 (2013.01); H05K 2201/09254 (2013.01); H05K 2201/09263 (2013.01); H05K 2201/09627 (2013.01); H05K 2201/10159 (2013.01);
Abstract

A printed wiring board includes a first main wire having first inner layer wiring patterns which are wired on inner layers connected by first via conductors in series. In addition, a second main wire has second inner layer wiring patterns which are wired on the inner layers connected by second via conductors. The first inner layer wiring patterns and the second inner layer wiring patterns are wired so as to change the layer to the inner layer on the opposite side to each other. First and second branch wires are branched from the first and second via conductors, respectively.


Find Patent Forward Citations

Loading…