The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 27, 2018
Filed:
Mar. 01, 2013
Applicant:
Dowa Metaltech Co., Ltd., Tokyo, JP;
Inventors:
Assignee:
Dowa Metaltech Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/01 (2006.01); H01R 13/03 (2006.01); C25D 3/46 (2006.01); C25D 5/10 (2006.01); C25D 5/34 (2006.01); H01H 1/02 (2006.01);
U.S. Cl.
CPC ...
H01R 13/03 (2013.01); C25D 3/46 (2013.01); C25D 5/10 (2013.01); C25D 5/34 (2013.01); H01H 1/02 (2013.01); Y10T 428/12896 (2015.01); Y10T 428/24355 (2015.01);
Abstract
There is provided a silver-plated product wherein a silver plating film having a thickness of not greater than 10 micrometers is formed on a base material of copper or a copper alloy and wherein the surface of the silver plating film has an arithmetic average roughness Ra of not greater than 0.1 micrometers, and the silver plating film has a {111} orientation ratio of not less than 35%.