The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 27, 2018
Filed:
Jun. 28, 2016
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Wei-Hsiang Huang, Hsinchu, TW;
Chung-Chuan Tseng, Hsinchu, TW;
Chia-Wei Liu, Zhubei, TW;
Li Hsin Chu, New Taipei, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Abstract
A method of partitioning a wafer includes defining a scribe line surrounding a set of dies. The method further includes etching a plurality of trenches into the wafer, wherein each trench of the plurality of trenches is located between adjacent dies of the set of dies, and a width of each trench of the plurality of trenches is less than a width of the scribe line. The method further includes thinning the wafer to expose a bottom surface of the plurality of trenches. The method further includes cutting along the scribe line to separate the set of dies from another portion of the wafer.