The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 20, 2018

Filed:

Jun. 15, 2016
Applicant:

United Microelectronics Corp., Hsin-Chu, TW;

Inventors:

Po-Wen Su, Kaohsiung, TW;

Zhen Wu, Kaohsiung, TW;

Hsiao-Pang Chou, Taipei, TW;

Chiu-Hsien Yeh, Tainan, TW;

Shui-Yen Lu, Tainan, TW;

Jian-Wei Chen, Kaohsiung, TW;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/51 (2006.01); H01L 21/82 (2006.01); H01L 27/088 (2006.01); H01L 29/66 (2006.01); H01L 29/40 (2006.01); H01L 21/8234 (2006.01); H01L 29/423 (2006.01);
U.S. Cl.
CPC ...
H01L 29/512 (2013.01); H01L 21/82345 (2013.01); H01L 21/823462 (2013.01); H01L 27/088 (2013.01); H01L 29/401 (2013.01); H01L 29/4236 (2013.01); H01L 29/66545 (2013.01);
Abstract

A semiconductor device and a method of forming the same, the semiconductor device include a substrate, and a first gate structure and a second gate structure disposed on the substrate. The first gate structure includes a barrier layer, a first work function layer, a second work function layer and a conductive layer stacked one over another on the substrate. The second gate structure includes the barrier layer, a portion of the first work function layer and the conductive layer stacked one over another on the substrate, wherein the portion of the first work function layer has a smaller thickness than a thickness of the first work function layer.


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