The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 20, 2018
Filed:
Aug. 12, 2016
Shinkawa Ltd., Tokyo, JP;
Naoki Sekine, Tokyo, JP;
SHINKAWA LTD., Tokyo, JP;
Abstract
A wire bonding apparatus includes: a bonding toolinto and through a wirepasses; a control unitthat performs a movement process of the bonding toolfor cutting the wireafter forming a wire loopbetween first and second bonding points of a bonding target; and a monitoring unitthat supplies a predetermined electric signal between the wirethrough the bonding tooland the bonding target, and monitors whether the wireis cut or not based on an output of the supplied electric signal. The control unitcontinues the movement process of the bonding toolwhile the wireis determined not to be cut, and stops the movement process of the bonding toolwhen the wireis determined to be cut, based on a monitoring result from the monitoring unit. This can shorten the operation time of the wire bonding, and improve the process efficiency of the wire bonding.