The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 20, 2018
Filed:
Aug. 24, 2016
Powertech Technology Inc., Hsinchu, TW;
Kuo-Ting Lin, Hsinchu, TW;
Chia-Wei Chang, Hsinchu, TW;
Powertech Technology Inc., Hsinchu County, TW;
Abstract
A fan-out chip package comprises a chip, an encapsulating layer, a first passivation layer, a redistribution wiring layer, a second passivation layer, and a plurality of vertical connectors. The encapsulation encapsulates the sides of the chip. The thickness of the encapsulation is the same as the thickness of the chip. The first passivation layer covers the active surface of the chip and the peripheral surface of the encapsulation. The redistribution layer is formed on the first passivation layer to extend the electrical connection of the chip to the peripheral surface of the encapsulation. The second passivation layer is formed on the first passivation layer. The vertical connectors are embedded in the encapsulation and the redistribution layer. The vertical connectors are only penetrate through the encapsulation protect the redistribution layer from damages.