The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 20, 2018
Filed:
Feb. 19, 2016
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Claudia Sgiarovello, Villach, AT;
Martin Mischitz, Wernberg, AT;
Andrew Wood, St. Jakob im Rosental, AT;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 31/26 (2014.01); H01L 21/66 (2006.01); H01L 23/525 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 22/22 (2013.01); H01L 23/525 (2013.01); H01L 25/0657 (2013.01);
Abstract
A method of manufacturing a wafer. The method includes providing a wafer and testing the wafer. Based on a test result, a substance is selectively provided on the wafer to obtain an altered wafer that has at least one selected portion altered. The method includes forming a structural layer over the altered wafer.