The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 20, 2018
Filed:
Mar. 07, 2013
Applicant:
Hitachi Metals, Ltd., Minato-ku, Tokyo, JP;
Inventors:
Hideo Nitta, Mishima-gun, JP;
Akira Shigekawa, Mishima-gun, JP;
Satoshi Shiota, Mishima-gun, JP;
Hiroyuki Nagatomo, Mishima-gun, JP;
Assignee:
HITACHI METALS, LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01T 1/20 (2006.01); G21K 4/00 (2006.01); C09K 11/77 (2006.01); C09K 11/88 (2006.01);
U.S. Cl.
CPC ...
G21K 4/00 (2013.01); C09K 11/7774 (2013.01); C09K 11/883 (2013.01); G01T 1/20 (2013.01); G01T 1/2008 (2013.01); Y10T 29/49888 (2015.01);
Abstract
A method for producing a scintillator dual array comprising the steps of bonding first and second scintillator bar arrays having different sensitivity distributions of X-ray energy detection and pluralities of parallel grooves with equal gaps, via an intermediate resin layer, such that both scintillator bars are aligned in a lamination direction, cutting the integrally bonded bar array in a direction crossing the scintillator bars, and coating one cut surface of each bonded bar array piece with a resin.