The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 20, 2018
Filed:
Sep. 16, 2014
Applicant:
The Boeing Company, Chicago, IL (US);
Inventor:
Matthew S. Stauffer, West Chester, PA (US);
Assignee:
The Boeing Company, Chicago, IL (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 47/00 (2006.01); B32B 5/12 (2006.01); B32B 3/28 (2006.01); B32B 5/02 (2006.01); B32B 5/22 (2006.01); B32B 5/26 (2006.01); B32B 7/00 (2006.01); B32B 27/08 (2006.01); B32B 27/36 (2006.01); B32B 3/14 (2006.01); B32B 3/18 (2006.01); B29C 64/106 (2017.01); B29C 64/386 (2017.01); B29L 31/30 (2006.01); B33Y 10/00 (2015.01); B33Y 50/02 (2015.01); B33Y 80/00 (2015.01);
U.S. Cl.
CPC ...
B29C 47/0045 (2013.01); B29C 64/106 (2017.08); B29C 64/386 (2017.08); B32B 3/14 (2013.01); B32B 3/18 (2013.01); B32B 3/28 (2013.01); B32B 5/022 (2013.01); B32B 5/12 (2013.01); B32B 5/22 (2013.01); B32B 5/26 (2013.01); B32B 7/005 (2013.01); B32B 27/08 (2013.01); B32B 27/365 (2013.01); B29L 2031/3076 (2013.01); B32B 2250/20 (2013.01); B32B 2262/02 (2013.01); B32B 2307/50 (2013.01); B32B 2605/18 (2013.01); B33Y 10/00 (2014.12); B33Y 50/02 (2014.12); B33Y 80/00 (2014.12); Y02T 50/433 (2013.01);
Abstract
Technologies for fused filament fabrication using multi-directional layering are disclosed herein. According to aspects of the disclosure, a component may be strengthened using a multi-directional layering manufacturing technique. In some implementations, one or more portions of the component are manufactured in different orientations. In still further implementations, one layer of a component is laid down in a first orientation and a second layer of the component is laid down in a second orientation.