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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9894772 B1

PDFFull Text
Date of Patent:
Feb. 13, 2018

Filed:

Mar. 15, 2017

Manufacturing method of molded photosensitive assembly for electronic device

Applicant:

Ningbo Sunny Opotech Co., Ltd., Ningbo, Zhejiang, CN;

Inventors:

Mingzhu Wang, Ningbo, CN;

Bojie Zhao, Ningbo, CN;

Zhenyu Chen, Ningbo, CN;

Takehiko Tanaka, Ningbo, CN;

Nan Guo, Ningbo, CN;

Zhen Huang, Ningbo, CN;

Duanliang Cheng, Ningbo, CN;

Liang Ding, Ningbo, CN;

Feifan Chen, Ningbo, CN;

Heng Jiang, Ningbo, CN;

Assignee:

Ningbo Sunny Opotech Co., Ltd., Ningbo, Zhejiang, CN;

Attorneys:

Raymond Y. Chan

David and Raymond Patent Firm

Primary Examiner:

Minh Trinh

Int. Cl.
CPC ...
H05K 3/00 (2006.01); H04N 5/225 (2006.01); B29C 45/14 (2006.01); G02B 7/02 (2006.01); G02B 7/00 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
H05K 3/0011 (2013.01); B29C 45/14639 (2013.01); G02B 7/006 (2013.01); G02B 7/021 (2013.01); H04N 5/2253 (2013.01); H04N 5/2254 (2013.01); H04N 5/2257 (2013.01); H04N 5/2258 (2013.01); B29L 2031/3481 (2013.01);
Abstract

A manufacturing method of a molded photosensitive assembly of an array imaging module includes the steps of providing an enclosing element at a mold engaging surface of a first mold body of a mold; receiving the circuit board in the mold and positioning between the first mold body and a second mold body; introducing a fluid state mold material into the closed mold to fill the mold cavity and enclose the electronic elements; solidifying the mold material in the mold cavity and forming a molded base integrated with the circuit board and the electronic elements; and separating the first mold body and the second mold body and obtaining a molded photosensitive assembly which is an integrated body of the circuit board, the electronic elements.

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Wang, Mingzhu. (2018). Manufacturing method of molded photosensitive assembly for electronic device (U.S. Patent No. 9894772). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9894772

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