The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 13, 2018

Filed:

Nov. 21, 2016
Applicant:

Foxconn Interconnect Technology Limited, Grand Cayman, KY;

Inventors:

Quan Wang, Shenzhen, CN;

Fu-Jin Peng, Shenzhen, CN;

Shan-Jun Chen, Shenzhen, CN;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/447 (2006.01); H01R 13/52 (2006.01); H01R 12/70 (2011.01);
U.S. Cl.
CPC ...
H01R 13/5213 (2013.01); H01R 12/7076 (2013.01);
Abstract

An electrical connector assembly is used for connecting to a chip module. The electrical connector assembly includes an electrical connector and a dust-proof cover. The electrical connector includes an insulative housing, a plurality of terminals and a shell covering the insulative housing. The insulative housing includes a second cavity for receiving the chip module. The shell defines an opening corresponding to the second cavity. The dust-proof cover includes a dust-proof portion covering the opening and a pair of inclined pushing portions protruding from the dust-proof portion to the second cavity. The dust-proof cover has a plurality of supporting portions for supporting the dust-proof portion. The supporting portions separate from the shell when the inclined pushing portion is pushed by the chip module, and the dust-proof cover separates from the electrical connector.


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