The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 13, 2018

Filed:

May. 31, 2017
Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventors:

Timothy J. McArdle, Ballston Lake, NY (US);

Judson R. Holt, Ballston Lake, NY (US);

Junli Wang, Singerlands, NY (US);

Assignee:

GLOBALFOUNDRIES INC., Grand Cayman, KY;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 29/161 (2006.01); H01L 27/092 (2006.01); H01L 21/8238 (2006.01); H01L 29/10 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01); H01L 29/04 (2006.01);
U.S. Cl.
CPC ...
H01L 29/161 (2013.01); H01L 21/823821 (2013.01); H01L 27/0924 (2013.01); H01L 29/045 (2013.01); H01L 29/1054 (2013.01); H01L 29/66795 (2013.01); H01L 29/785 (2013.01);
Abstract

Semiconductor device fabrication method and structures are provided having a substrate structure which includes a silicon layer at an upper portion. The silicon layer is recessed in a first region of the substrate structure and remains unrecessed in a second region of the substrate structure. A protective layer having a first germanium concentration is formed above the recessed silicon layer in the first region, which extends along a sidewall of the unrecessed silicon layer of the second region. A semiconductor layer having a second germanium concentration is disposed above the protective layer in the first region of the substrate structure, where the first germanium concentration of the protective layer inhibits lateral diffusion of the second germanium concentration from the semiconductor layer in the first region into the unrecessed silicon layer in the second region of the substrate structure.


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