The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 13, 2018
Filed:
Sep. 13, 2016
Applicant:
Magnachip Semiconductor, Ltd., Cheongju-si, KR;
Inventors:
Francois Hebert, San Mateo, CA (US);
Seong Min Choe, Seongnam-si, KR;
Assignee:
Magnachip Semiconductor, Ltd., Cheongju-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/144 (2006.01); H01L 31/02 (2006.01); H01L 31/0216 (2014.01); H01L 31/0368 (2006.01); H01L 31/0392 (2006.01); H01L 31/103 (2006.01);
U.S. Cl.
CPC ...
H01L 27/1443 (2013.01); H01L 31/02019 (2013.01); H01L 31/02164 (2013.01); H01L 31/03682 (2013.01); H01L 31/03921 (2013.01); H01L 31/103 (2013.01);
Abstract
The present disclosure relates to a photo sensor module. The thickness and size of an IC chip may be reduced by manufacturing a photo sensor based on a semiconductor substrate and improving the structure to place a UV sensor on the upper section of an active device or a passive device. The photo sensor module includes a semiconductor substrate, a field oxide layer, formed on the semiconductor substrate, and a photo sensor comprising a photo diode formed on the field oxide layer.