The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 13, 2018
Filed:
Dec. 08, 2016
Applicant:
Shinko Electric Industries Co., Ltd., Nagano-shi, Nagano-ken, JP;
Inventor:
Tomoyuki Shimodaira, Nagano, JP;
Assignee:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49816 (2013.01); H01L 21/4853 (2013.01); H01L 23/3185 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/49866 (2013.01); H01L 24/05 (2013.01); H01L 24/08 (2013.01); H01L 2224/08238 (2013.01); H01L 2924/0132 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1432 (2013.01); H01L 2924/1436 (2013.01); H01L 2924/1437 (2013.01); H01L 2924/1438 (2013.01); H01L 2924/15747 (2013.01); H01L 2924/3512 (2013.01);
Abstract
A terminal structure of a wiring substrate includes a wiring layer, a protective insulation layer including an opening that partially exposes an upper surface of the wiring layer, and a connection terminal formed on the wiring layer. The connection terminal includes a base portion formed in the opening and a connection portion formed on the base portion. The connection portion projects from an upper surface of the protective insulation layer. A gap is formed between a side surface of the base portion and a wall surface of the opening.