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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9892302 B1

PDFFull Text
Date of Patent:
Feb. 13, 2018

Filed:

Sep. 02, 2016

Fingerprint sensing device and method for producing the same

Applicant:

Tong Hsing Electronic Industries, Ltd., Taipei, TW;

Inventors:

Chia-Shuai Chang, Taipei, TW;

Zzu-Chi Chiu, Taipei, TW;

Chien-Cheng Wei, Taipei, TW;

Assignee:

Tong Hsing Electronic Industries, Ltd., Taipei, TW;

Attorney:

McNees Wallace & Nurick LLC

Primary Examiner:

Amir Alavi

Int. Cl.
CPC ...
G06K 9/00 (2006.01); H01L 31/14 (2006.01); H01L 25/00 (2006.01); H01L 25/16 (2006.01); H01L 27/146 (2006.01); H01L 33/48 (2010.01);
U.S. Cl.
CPC ...
G06K 9/00013 (2013.01); H01L 25/165 (2013.01); H01L 25/50 (2013.01); H01L 31/143 (2013.01); H01L 25/167 (2013.01); H01L 27/14678 (2013.01); H01L 33/48 (2013.01); H01L 2224/48091 (2013.01);
Abstract

A fingerprint sensing device includes an insulating package, an image-sensing die, a light-emitting element, and a conductive component. The insulating package has a bottom surface and a top surface formed with first and second recesses. The image-sensing die is disposed in the first recess and has an outer surface exposed therefrom. The light-emitting element is disposed in the second recess and has an outer surface exposed from the second recess, and an electrode unit. The conductive component is formed in the insulating package, has top and bottom ends exposed from the top and bottom surfaces of the insulating package, and is electrically coupled to the image-sensing die and the electrode unit.

Find Patent Forward Citations

Chang, Chia-Shuai. (2018). Fingerprint sensing device and method for producing the same (U.S. Patent No. 9892302). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9892302

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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