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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9890254 B1

PDFFull Text
Date of Patent:
Feb. 13, 2018

Filed:

Jan. 07, 2015

Resin composition, resin film, and semiconductor device and method for manufacturing same

Applicant:

Shin-etsu Chemical Co., Ltd., Tokyo, JP;

Inventors:

Kazunori Kondo, Annaka, JP;

Yoichiro Ichioka, Annaka, JP;

Assignee:

SHIN-ETSU CHEMICAL CO., LTD., Tokyo, JP;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

Margaret G Moore

Int. Cl.
CPC ...
C08L 63/00 (2006.01); C08G 77/48 (2006.01); C08G 77/52 (2006.01); C08G 59/32 (2006.01); C08K 3/36 (2006.01); H01L 23/29 (2006.01); C09D 163/00 (2006.01); C08L 83/14 (2006.01); C09D 183/14 (2006.01); H01L 21/56 (2006.01); H01L 21/78 (2006.01); C08G 59/30 (2006.01);
U.S. Cl.
CPC ...
C08G 77/48 (2013.01); C08G 59/306 (2013.01); C08G 59/32 (2013.01); C08G 77/52 (2013.01); C08K 3/36 (2013.01); C08L 63/00 (2013.01); C08L 83/14 (2013.01); C09D 163/00 (2013.01); C09D 183/14 (2013.01); H01L 21/561 (2013.01); H01L 21/563 (2013.01); H01L 21/78 (2013.01); H01L 23/295 (2013.01); H01L 23/296 (2013.01); H01L 2924/0002 (2013.01);
Abstract

The present invention relates to a resin composition containing components (A), (B), and (C), component (A) being a silicone resin having a weight-average molecular weight of 3,000-500,000 and having constituent units represented by compositional formula (1), component (B) being an epoxy resin curing agent, and component (C) being a filler. The present invention is capable of providing a resin film and a resin composition whereby wafers can be molded (wafer molding) in batch fashion, the resin composition having good molding properties with respect to large-diameter thin-film wafers in particular while at the same time imparting low warpage after molding and good wafer-protective ability, the resin composition also facilitating the molding step and being suitable for use in wafer-level packaging.

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