The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 13, 2018
Filed:
Nov. 30, 2016
Applicant:
Nxp Usa,inc., Austin, TX (US);
Inventors:
Assignee:
NXP B.V., San Jose, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81B 7/00 (2006.01); H01L 23/24 (2006.01); B81C 1/00 (2006.01); G01L 19/14 (2006.01); G01L 19/00 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
B81B 7/0038 (2013.01); B81C 1/00285 (2013.01); G01L 19/0076 (2013.01); G01L 19/141 (2013.01); H01L 23/24 (2013.01); H01L 23/3135 (2013.01); B81B 2201/0264 (2013.01);
Abstract
A semiconductor sensor device is assembled using a lead frame having a flag surrounded by lead fingers. A pressure sensor die is mounted on the flag and electrically connected to the leads. Prior to encapsulation, a pre-formed block of gel material is placed over the sensor region on the die. Encapsulation is performed and mold compound covers the pressure sensor die and the bond wires. Mold compound covering the gel block may be removed. Additionally, a trench may be formed around an upper portion of the gel block so that the lateral sides of the gel block are at least partially exposed.