The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 06, 2018

Filed:

Sep. 11, 2015
Applicant:

Fuji Electric Co., Ltd., Kawasaki-shi, Kanagawa, JP;

Inventors:

Takafumi Yamada, Matsumoto, JP;

Hiromichi Gohara, Matsumoto, JP;

Yoshitaka Nishimura, Azumino, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kawasaki-shi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01L 23/473 (2006.01); H01L 23/373 (2006.01); H01L 23/24 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 25/07 (2006.01); H01L 25/18 (2006.01); H01L 23/488 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20263 (2013.01); H01L 21/4871 (2013.01); H01L 23/24 (2013.01); H01L 23/3735 (2013.01); H01L 23/473 (2013.01); H01L 23/562 (2013.01); H05K 7/205 (2013.01); H05K 7/20927 (2013.01); H01L 23/488 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 25/072 (2013.01); H01L 25/18 (2013.01); H01L 2224/291 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/181 (2013.01); H01L 2924/3511 (2013.01); H01L 2924/3512 (2013.01);
Abstract

A power semiconductor module includes an insulated wiring board; semiconductor elements mounted on one main surface of the insulated wiring board; a heat radiation board bonded to another main surface of the insulated wiring board; a plurality of fins including a first group of fins each having one end fixed to the another main surface of the heat radiation board and another end with a free end; and a water jacket housing the plurality of fins and allowing coolant to flow among the plurality of fins. The plurality of fins further includes a second group of fins as reinforced fins each having one end fixed to the another main surface of the heat radiation board and another end bonded to the water jacket.


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