The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 06, 2018

Filed:

Jan. 14, 2014
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

Inventors:

Hsiu-Jen Lin, Zhubei, TW;

Wei-Yu Chen, Taipei, TW;

Ai-Tee Ang, Hsin-Chu, TW;

Ming-Da Cheng, Jhubei, TW;

Chung-Shi Liu, Hsin-Chu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A21B 1/22 (2006.01); H05B 3/02 (2006.01); H01L 21/677 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H05B 3/02 (2013.01); H01L 21/67721 (2013.01); H01L 21/6838 (2013.01); H01L 24/75 (2013.01); H01L 24/81 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/7598 (2013.01); H01L 2224/75744 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/97 (2013.01); H01L 2924/3511 (2013.01); Y10T 29/41 (2015.01);
Abstract

Systems for processing semiconductor devices, and methods of processing semiconductor devices are disclosed. In some embodiments, a system for processing semiconductor devices includes a radiation energy source, a support, and a tool disposable between the support and the radiation energy source. The tool includes apertures adapted to retain a package component over the support. The system includes a cooling device proximate the support.


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