The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 06, 2018

Filed:

Aug. 29, 2014
Applicants:

LI Qiang, Gilbert, AZ (US);

Olin Lee Hartin, Scottsdale, AZ (US);

Ralf Reuter, Munich, DE;

Ziqiang Tong, Munich, DE;

Inventors:

Li Qiang, Gilbert, AZ (US);

Olin Lee Hartin, Scottsdale, AZ (US);

Ralf Reuter, Munich, DE;

Ziqiang Tong, Munich, DE;

Assignee:

NXP USA, Inc., Austin, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01P 11/00 (2006.01); G01S 7/03 (2006.01); G01S 13/02 (2006.01); H01P 5/02 (2006.01); H05K 1/02 (2006.01); H01P 3/12 (2006.01); G01S 13/93 (2006.01); H05K 1/14 (2006.01);
U.S. Cl.
CPC ...
H01P 11/003 (2013.01); G01S 7/03 (2013.01); G01S 13/02 (2013.01); H01P 5/024 (2013.01); H05K 1/0274 (2013.01); G01S 13/931 (2013.01); H01P 3/121 (2013.01); H05K 1/0243 (2013.01); H05K 1/144 (2013.01); H05K 2201/0187 (2013.01); H05K 2201/041 (2013.01); H05K 2201/09854 (2013.01); H05K 2201/09981 (2013.01);
Abstract

A radio frequency transmission structure couples a RF signal between a first and a second radiating elements arranged at a first and a second sides of a first dielectric substrate, respectively. The RF coupling structure comprises: a hole arranged through the first dielectric substrate, a first electrically conductive layer arranged on a first wall of the hole to electrically connect a first and a second signal terminals, a second electrically conductive layer arranged on a second wall of the hole opposite to the first wall to electrically connect a first and a second reference terminals. The first electrically conductive layer is separated from the second electrically conductive layer. The hole extends beyond the first wall away from the second wall.


Find Patent Forward Citations

Qiang, Li. (2018). Radio frequency coupling structure and a method of manufacturing thereof (U.S. Patent No. 9887449). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9887449

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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