The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 06, 2018

Filed:

Jul. 10, 2014
Applicant:

Kabushiki Kaisha Toshiba, Minato-ku, JP;

Inventors:

Hideyuki Tomizawa, Kanazawa, JP;

Akihiro Kojima, Nonoichi, JP;

Miyoko Shimada, Hakusan, JP;

Yosuke Akimoto, Nonoichi, JP;

Hideko Mukaida, Kunitachi, JP;

Mitsuyoshi Endo, Yamato, JP;

Hideto Furuyama, Yokohama, JP;

Yoshiaki Sugizaki, Fujisawa, JP;

Kazuo Fujimura, Kanazawa, JP;

Shinya Ito, Kanazawa, JP;

Shinji Nunotani, Kanazawa, JP;

Assignee:

Kabushiki Kaisha Toshiba, Minato-ku, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 33/54 (2010.01); H01L 33/00 (2010.01); H01L 33/46 (2010.01); H01L 33/50 (2010.01); H01L 33/60 (2010.01);
U.S. Cl.
CPC ...
H01L 33/54 (2013.01); H01L 33/0079 (2013.01); H01L 33/46 (2013.01); H01L 33/505 (2013.01); H01L 33/60 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0025 (2013.01);
Abstract

According to one embodiment, a semiconductor light emitting device includes a semiconductor layer, a sealing member configured to cover a lower surface of the semiconductor layer and a side surface of the semiconductor layer to protrude to be higher than an upper surface of the semiconductor layer at a side of the semiconductor layer, a fluorescer layer provided above the semiconductor layer and the sealing member, and an insulating film provided between the sealing member and the semiconductor layer and between the sealing member and the fluorescer layer. A corner of a protruding portion of the sealing member is rounded.


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