The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 06, 2018

Filed:

Jan. 10, 2017
Applicant:

United Microelectronics Corp., Hsin-Chu, TW;

Inventor:

Mengkai Zhu, Singapore, SG;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 23/528 (2006.01); H01L 29/41 (2006.01); H01L 29/78 (2006.01); H01L 29/66 (2006.01); H01L 21/762 (2006.01); H01L 21/033 (2006.01); H01L 29/06 (2006.01); H01L 21/74 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5283 (2013.01); H01L 21/0332 (2013.01); H01L 21/743 (2013.01); H01L 21/76224 (2013.01); H01L 21/76816 (2013.01); H01L 21/76877 (2013.01); H01L 29/0653 (2013.01); H01L 29/66492 (2013.01); H01L 29/7833 (2013.01);
Abstract

A method for fabricating semiconductor device includes the steps of: providing a substrate having a first semiconductor layer, an insulating layer, and a second semiconductor layer; forming an active device on the substrate; forming an interlayer dielectric (ILD) layer on the substrate and the active device; forming a mask layer on the ILD layer; removing part of the mask layer, part of the ILD layer, and part of the insulating layer to form a first contact hole; forming a patterned mask on the mask layer and into the first contact hole; and removing part of the mask layer and part of the ILD layer to form a second contact hole exposing part of the active device.


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