The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 06, 2018
Filed:
Jun. 06, 2016
Renesas Electronics Corporation, Tokyo, JP;
Yukihiro Sato, Tokyo, JP;
Akira Muto, Tokyo, JP;
Ryo Kanda, Tokyo, JP;
Takamitsu Kanazawa, Tokyo, JP;
RENESAS ELECTRONICS CORPORATION, Tokyo, JP;
Abstract
To improve the reliability of a semiconductor device. A chip mounting portion TABis arranged to be shifted to the +x direction side. Further, a gate electrode pad of a semiconductor chip CHP(LV) and a pad of a semiconductor chip CHPare electrically coupled by a wire Wand a wire Wthrough a relay lead RL. Likewise, a gate electrode pad of a semiconductor chip CHP(LW) and the pad of the semiconductor chip CHPare electrically coupled by a wire Wand a wire Wthrough a relay lead RL. At this time, the structures of parts of the relay leads RLand RL, which are exposed from a sealing body MR are different from the structures of respective parts exposed from the sealing body MR, of a plurality of leads LDand LDwhich function as external terminals.