The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 06, 2018
Filed:
Feb. 26, 2016
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Tai-Tsung Hsu, Taichung, TW;
Cheng-Yu Chiang, Tauchung, TW;
Miao-Wen Chen, Taichung, TW;
Wen-Jung Chiang, Taichung, TW;
Hsin-Hung Lee, Taichung, TW;
Siliconware Precision Industries Co., Ltd., Taichung, TW;
Abstract
A multi-chip package structure is provided, including a substrate having a grounding structure; two semiconductor elements disposed on and electrically connected to the substrate; an encapsulant formed on the substrate and encapsulating semiconductor elements, wherein the encapsulant has a plurality of round holes formed between the semiconductor elements; and an electromagnetic shielding structure formed in each of the round holes and connected to the grounding structure to achieve electromagnetic shielding effects. A method for forming the multi-chip package is also provided.