The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 06, 2018
Filed:
Dec. 21, 2012
Applicant:
A.l.m.t. Corp., Minato-ku, Tokyo, JP;
Inventors:
Shigekazu Yamazaki, Toyama, JP;
Ayuri Tsuji, Toyama, JP;
Masahiro Katoh, Toyama, JP;
Seiji Nakabayashi, Toyama, JP;
Akihiko Ikegaya, Toyama, JP;
Assignee:
A.L.M.T. Corp., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B22F 1/00 (2006.01); C22C 27/04 (2006.01); C22C 1/04 (2006.01); B22F 9/04 (2006.01);
U.S. Cl.
CPC ...
B22F 1/0003 (2013.01); B22F 9/04 (2013.01); C22C 1/045 (2013.01); C22C 27/04 (2013.01); B22F 2009/041 (2013.01); B22F 2301/20 (2013.01); B22F 2998/10 (2013.01);
Abstract
A Mo—Si—B-based alloy for a heat-resistant alloy that satisfies, more than conventional, physical properties such as proof stress and hardness adapted to an increase in the melting point of 5 a welding object. The Mo—Si—B-based alloy powder is such that the full width at half maximum of (600) of Mo5SiB2 in X-ray diffraction peak data is 0.08 degrees or more and 0.7 degrees or less.