The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 30, 2018

Filed:

Mar. 30, 2016
Applicants:

Petteri Palm, Regensburg, DE;

Risto Tuominen, Helsinki, FI;

Antti Iihola, Helsinki, FI;

Inventors:

Petteri Palm, Regensburg, DE;

Risto Tuominen, Helsinki, FI;

Antti Iihola, Helsinki, FI;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); H05K 1/18 (2006.01); H01L 21/48 (2006.01); H05K 3/30 (2006.01);
U.S. Cl.
CPC ...
H05K 1/09 (2013.01); H01L 23/498 (2013.01); H01L 23/49811 (2013.01); H01L 23/49838 (2013.01); H01L 23/49866 (2013.01); H01L 23/5384 (2013.01); H01L 23/5389 (2013.01); H01L 24/19 (2013.01); H01L 24/24 (2013.01); H01L 24/82 (2013.01); H05K 1/182 (2013.01); H05K 1/188 (2013.01); H01L 21/486 (2013.01); H01L 2221/68359 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/24137 (2013.01); H01L 2224/24227 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/92144 (2013.01); H01L 2924/0102 (2013.01); H01L 2924/0103 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01023 (2013.01); H01L 2924/01024 (2013.01); H01L 2924/01027 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/01075 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1433 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/1517 (2013.01); H01L 2924/15153 (2013.01); H01L 2924/351 (2013.01); H05K 3/305 (2013.01); H05K 2201/0355 (2013.01); H05K 2201/0969 (2013.01); H05K 2201/09509 (2013.01); H05K 2201/10674 (2013.01); H05K 2203/063 (2013.01); Y10T 29/4913 (2015.01); Y10T 29/49117 (2015.01);
Abstract

Manufacturing method and circuit module, which comprises an insulator layer and, inside the insulator layer, at least one component, which comprises contact areas, the material of which contains a first metal. On the surface of the insulator layer are conductors, which comprise at least a first layer and a second layer, in such a way that at least the second layer contains a second metal. The circuit module comprises contact elements between the contact areas and the conductors for forming electrical contacts. The contact elements, for their part, comprise, on the surface of the material of the contact area, an intermediate layer, which contains a third metal, in such a way that the first, second, and third metals are different metals and the contact surface area (A), between the intermediate layer and the contact area is less that the surface area (A) of the contact area.


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