The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 30, 2018
Filed:
Dec. 18, 2014
Applicant:
Synopsys Taiwan Co., Ltd., Taipei, TW;
Inventors:
Hsien-Shih Chiu, Taipei, TW;
Kai-Shun Hu, Taipei, TW;
Assignee:
SYNOPSYS, INC., Mountain View, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/82 (2006.01); H01L 21/44 (2006.01); H01L 21/48 (2006.01); H01L 21/50 (2006.01); G06F 17/50 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
G06F 17/5077 (2013.01); H01L 21/4846 (2013.01); H01L 23/49838 (2013.01); H01L 23/49811 (2013.01); H01L 2224/16225 (2013.01);
Abstract
A method for routing a circuit device having an array of bump pads includes identifying a routing direction associated with a bump, generating a power strap and a ground strap based on the routing direction, forming a routing channel in accordance with the routing direction, setting a start point and an endpoint in the routing channel, and connecting the start point and the endpoint using a wire within the routing channel. The method further includes placing the start point to a power or ground strap in response to a target power/ground ratio.