The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 30, 2018
Filed:
Jan. 15, 2016
Lam Research Corporation, Fremont, CA (US);
Christopher William Burkhart, Los Gatos, CA (US);
Andrew C. Lee, Daly City, CA (US);
Lam Research Corporation, Fremont, CA (US);
Abstract
A manifold constructed by additive manufacturing for use in semiconductor processing tools is provided. The manifold may include a mixing chamber and portions of a plurality of flow paths with each flow path including a first fluid flow component interface, a second fluid flow component interface, a first tubular passage fluidically connecting the first mixing chamber with a first fluid flow component interface outlet of that flow path, and a second tubular passage fluidically connecting a first fluid flow component interface inlet of that flow path with a second fluid flow component interface outlet of that flow path. Each fluid flow component interface is configured to interface with a corresponding fluid flow component such that the corresponding fluid flow component, when installed, is able to interact with fluid flow between the fluid flow component interface inlet and the fluid flow component interface outlet.