The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 23, 2018

Filed:

Dec. 23, 2015
Applicant:

Epistar Corporation, Hsinchu, TW;

Inventors:

Jai-Tai Kuo, Hsinchu, TW;

Min-Hsun Hsieh, Hsinchu, TW;

Lung-Kuan Lai, Hsinchu, TW;

Wei-Kang Cheng, Hsinchu, TW;

Chien-Liang Liu, Hsinchu, TW;

Yih-Hua Renn, Hsinchu, TW;

Shou-Lung Chen, Hsinchu, TW;

Tsun-Kai Ko, Hsinchu, TW;

Chi-Chih Pu, Hsinchu, TW;

Assignee:

EPISTAR CORPORATION, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/24 (2006.01); H01L 33/62 (2010.01); H01L 33/60 (2010.01); H01L 33/50 (2010.01); H01L 33/56 (2010.01); H01L 33/46 (2010.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 33/507 (2013.01); H01L 33/56 (2013.01); H01L 33/60 (2013.01); H01L 33/46 (2013.01); H01L 2224/18 (2013.01);
Abstract

This disclosure discloses a light-emitting device. The light-emitting device includes a light-emitting diode, a metal bump, and a reflective insulation layer. The light-emitting diode includes an active layer, an insulation layer formed on the active layer and having a side surface, and a pad electrically connected to the active layer. The metal bump is formed on the pad. The reflective insulation layer covers the side surface.


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