IDiyas

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9875948 B1

PDFFull Text
Date of Patent:
Jan. 23, 2018

Filed:

Jan. 23, 2017

Package wafer processing method

Applicant:

Disco Corporation, Tokyo, JP;

Inventors:

Xin Lu, Tokyo, JP;

Makoto Tanaka, Tokyo, JP;

Assignee:

DISCO CORPORATION, Tokyo, JP;

Attorney:

Greer Burns & Crain, Ltd.

Primary Examiner:

Mary Wilczewski

Assistant Examiner:

Erik T Peterson

Int. Cl.
CPC ...
H01L 21/66 (2006.01); B23K 26/364 (2014.01); H01L 21/68 (2006.01); B23K 26/03 (2006.01); H01L 21/67 (2006.01); H01L 23/544 (2006.01); H01L 21/78 (2006.01);
U.S. Cl.
CPC ...
H01L 22/26 (2013.01); B23K 26/032 (2013.01); B23K 26/364 (2015.10); H01L 21/67092 (2013.01); H01L 21/681 (2013.01); H01L 21/78 (2013.01); H01L 23/544 (2013.01); H01L 2223/54426 (2013.01);
Abstract

A package wafer processing method includes a processing step of processing a package wafer along planned dividing lines by a laser beam irradiation unit and forming processing grooves in the package wafer. The processing step includes detecting a processing groove and an exposed key pattern closest to the planned dividing line corresponding to the processing groove at a predetermined timing and measuring, as a deviation amount, the difference between the distance from the processing groove to the exposed key pattern and the distance that is registered in a registration step and is from the planned dividing line corresponding to the processing groove to the closest key pattern. An indexing feed mechanism is corrected according to the deviation amount.

Find Patent Forward Citations

Loading…