The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 23, 2018

Filed:

Apr. 29, 2016
Applicant:

Tel Epion Inc., Billerica, MA (US);

Inventors:

Noel Russell, Waterford, NY (US);

Soo Doo Chae, Guilderland, NY (US);

Vincent Gizzo, East Greenbush, NY (US);

Joshua LaRose, Albany, NY (US);

Nicholas Joy, Ballston Lake, NY (US);

Assignee:

TEL Epion Inc., Billerica, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); H01L 21/311 (2006.01); H01L 21/28 (2006.01); H01L 21/3105 (2006.01); H01L 21/321 (2006.01); H01L 21/3213 (2006.01);
U.S. Cl.
CPC ...
H01L 22/20 (2013.01); H01L 21/28079 (2013.01); H01L 21/28088 (2013.01); H01L 21/31051 (2013.01); H01L 21/31055 (2013.01); H01L 21/31116 (2013.01); H01L 21/32115 (2013.01); H01L 21/32135 (2013.01); H01L 22/12 (2013.01);
Abstract

A method for correcting a surface profile on a substrate is described. In particular, the method includes receiving a substrate having a heterogeneous layer composed of a first material and a second material, wherein the heterogeneous layer has an initial upper surface exposing the first material and the second material, and defining a first surface profile across the substrate. The method further includes setting a target surface profile for the heterogeneous layer, selectively removing at least a portion of the first material using a gas cluster ion beam (GCIB) etching process, and recessing the first material beneath the second material, and thereafter, selectively removing at least a portion of the second material to achieve a final upper surface exposing the first material and the second material, and defining a second surface profile, wherein the second surface profile is within a pre-determined tolerance of the target surface profile.


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