The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 23, 2018

Filed:

Nov. 29, 2015
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Iris Moder, Villach, AT;

Ingo Muri, Villach, AT;

Johannes Baumgartl, Riegersdorf, AT;

Oliver Hellmund, Neubiberg, DE;

Manfred Engelhardt, Villach-Landskron, AT;

Hans-Joachim Schulze, Taufkirchen, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/76 (2006.01); H01L 21/762 (2006.01); H01L 21/20 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76267 (2013.01); H01L 21/76283 (2013.01); H01L 21/02647 (2013.01); H01L 21/2022 (2013.01); H01L 21/76248 (2013.01); H01L 21/76264 (2013.01); H01L 21/76272 (2013.01); H01L 21/76281 (2013.01); H01L 21/76286 (2013.01); H01L 21/76289 (2013.01); H01L 21/76297 (2013.01);
Abstract

A method for fabricating a semiconductor device includes forming an opening in a first epitaxial lateral overgrowth region to expose a surface of the semiconductor substrate within the opening. The method further includes forming an insulation region at the exposed surface of the semiconductor substrate within the opening and filling the opening with a second semiconductor material to form a second epitaxial lateral overgrowth region using a lateral epitaxial growth process.


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