The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 23, 2018
Filed:
Jan. 29, 2016
Myeong-koo Kim, Suwon-si, KR;
Nae-ry Yu, Suwon-si, KR;
Won-ki Lee, Seoul, KR;
Hyun-woo Kim, Seongnam-si, KR;
Song-se Yi, Seoul, KR;
Min-soo Kim, Seoul, KR;
Jae-yeol Baek, Anyang-si, KR;
Hyun-ji Song, Anyang-si, KR;
Myeong-koo Kim, Suwon-si, KR;
Nae-ry Yu, Suwon-si, KR;
Won-ki Lee, Seoul, KR;
Hyun-woo Kim, Seongnam-si, KR;
Song-se Yi, Seoul, KR;
Min-soo Kim, Seoul, KR;
Jae-yeol Baek, Anyang-si, KR;
Hyun-ji Song, Anyang-si, KR;
SAMSUNG ELECTRONICS CO., LTD., , KR;
SAMSUNG SDI CO., LTD., , KR;
Abstract
Methods of forming a hardmask material film are provided. The methods may include preparing a substrate including a first region that includes first patterns with a first density and a second region that includes second patterns with a second density that is lower than the first density or is free of patterns, forming a first hardmask material film in gaps between the first patterns and on surfaces of the first region and the second region, performing a heat treatment on the first hardmask material film such that solvent solubility of portions of the first hardmask material film in the gaps between the first patterns becomes different from solvent solubility of portions of the first hardmask material film outside the gaps, removing the first hardmask material film formed on the surfaces of the first region and the second region such that the portions of the first hardmask material film in the gaps at least partially remain in the gaps, and forming a second hardmask material film on the surfaces of the first region and the second region.