The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 23, 2018

Filed:

Jun. 30, 2015
Applicant:

Cascade Microtech, Inc., Beaverton, OR (US);

Inventors:

Kenneth R. Smith, Beaverton, OR (US);

Mike Jolley, Beaverton, OR (US);

Eric Strid, Portland, OR (US);

Peter Hanaway, Portland, OR (US);

K. Reed Gleason, Portland, OR (US);

Koby L. Duckworth, Newberg, OR (US);

Assignee:

Cascade Microtech, Inc., Beaverton, OR (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 31/00 (2006.01); G01R 31/02 (2006.01); G01R 31/28 (2006.01); G01R 1/073 (2006.01); H01L 21/48 (2006.01); G01R 1/067 (2006.01);
U.S. Cl.
CPC ...
G01R 1/0735 (2013.01); G01R 1/07342 (2013.01); H01L 21/4825 (2013.01); H01L 21/4828 (2013.01); H01L 21/4842 (2013.01); H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); G01R 1/06727 (2013.01); G01R 1/06733 (2013.01); Y10T 29/49155 (2015.01);
Abstract

Resilient electrical interposers that may be utilized to form a plurality of electrical connections between a first device and a second device, as well as systems that may utilize the resilient electrical interposers and methods of use and/or fabrication thereof. The resilient electrical interposers may include a resilient dielectric body with a plurality of electrical conduits contained therein. The plurality of electrical conduits may be configured to provide a plurality of electrical connections between a first surface of the electrical interposer and/or the resilient dielectric body and a second, opposed, surface of the electrical interposer and/or the resilient dielectric body. The systems and methods disclosed herein may provide for improved vertical compliance, improved contact force control, and/or improved dimensional stability of the resilient electrical interposers.


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